PCI-SIG Developers Conference APAC Tour 2025 Agenda

Penang, Malaysia

Thursday, February 13, 2025
8:00 - 9:00  Registration
9:00 - 9:15 Welcome
9:30 - 11:00 PCI Express Basics & Background
11:00 - 11:30 AM Break
11:30 - 12:30 PCIe 6.x Electrical Update
12:30 - 1:30 Lunch 
1:30 - 2:30 PCIe CEM Updates
2:30 - 3:30 PCIe 6.x Protocol Update 
3:30 - 4:00 PM Break 
4:00 - 5:00 PCIe 6.x PHY Logical 
5:00 - 6:00 PCIe Compliance Updates

Taipei, Taiwan 

Day One – Monday, February 17, 2025
8:30 - 9:30  Registration & Check-in
9:15 - 9:30  Welcome
9:30 - 11:00 PCI Express Basics & Background 
11:00 - 11:30 AM Break & Exhibit
11:30 - 12:30 PCIe 6.x Electrical Update 
12:30 - 1:30 Lunch & Exhibit
1:30 - 2:30 PCIe CEM Updates
2:30 - 3:30 PCIe 6.x Protocol Update 
3:30 - 4:00 PM Break & Exhibit
4:00 - 5:00 PCIe 6.x PHY Logical
5:00 - 6:00 PCIe Compliance Updates 

 

Day Two - Tuesday, February 18, 2025
8:30 - 9:30  Registration & Check-in
9:30 - 10:15 PCIe Reach Extension Solutions and Trade-Offs
10:15 - 10:45 AM Break & Exhibit
10:45 - 11:30 Heterogeneous Multiprocessor System with PCIe Non-Transparent Bridging
11:30 - 12:15 Large Scale Disaggregated Computing with ExpEther Technology
12:15 - 1:15 Lunch & Exhibit
1:15 - 2:00 Characterization of 128GT/s Measurement Paths
2:00 - 2:45 Authentication to Encryption: Reinforcing PCIe Security
2:45 - 3:15 PM Break & Exhibit
3:15 - 4:00 IDE Verification and Practical Implementation Insights
4:00 - 4:45 Efficacious Verification of PCIe Speed Change Algorithm

Speakers and Abstracts 


Suprio Biswas
Suprio Biswas is a Lead Member of Technical Staff in the VIP team of Siemens EDA. He has completed his B.Tech in Electronics and Communication Engineering from Netaji Subhas Institute of Technology. He has 4 years of working experience in PCIe Gen5 and Gen6 VIPs.

Authentication to Encryption: Reinforcing PCIe Security
This presentation highlights the critical need for a robust security software stack and explores the seamless integration of advanced security layers within the PCIe architecture. Introduction of Security Stack 1. The PCIe Security Stack comprises three layers: SPDM for authentication and key exchange, TDISP for transport integrity, and IDE for data encryption and how integration across these layers is achieved through Data Object Exchange (DOE) 2. Verification scenarios will be discussed which would distinguish the explicit needs for all the layers. Requirement of Security Stack 1. SPDM Layer: Ensures device authenticity and data integrity using cryptographic algorithms. 2. IDE Layer: Secures PCIe traffic with encryption, protecting data transfer over untrusted links. 3. TDISP Layer: Prevents unauthorized access to device memory and configuration space for enhanced security.


Chris Blackburn

Chris Blackburn is Director of Field Applications Engineering at Astera Labs. He works closely with the leading hyperscalers and cloud builders on their interconnect technologies to enable next generation system architectures. His experience with PCIe, CXL, and Ethernet helps shape large-scale hardware acceleration clusters being built to support generative AI.
PCIe Reach Extension Solutions and Trade-Offs
The growth in size and complexity of new AI clusters is driving new requirements for reach extension in PCIe systems. Attendees at this presentation will learn about the state of current and next generation reach extension options and trade-offs from passive cabling; active electrical cabling; and new optical cabling work ongoing. Each technology solution will be compared with a focus on distance, latency, and compliance status. The presentation will also cover the ability of each technology to address advanced metrics and fleet management features necessary for these next-generation systems.

Paul Cassidy
Paul Cassidy is a Senior R&D Manager for Synopsys’ DesignWare PCI Express Controller IP, based in Dublin, Ireland. With 20 years of industry experience, Paul has worked on the architecture and design of Synopsys PCI Express controller since joining Synopsys in 2009. Paul has a BEng from University College Cork.
PCIe 6.x Protocol Update
This session covers PCI Express protocol developments over the last year or two, including completed ECNs, selected ECRs under development, and major protocol/spec changes in PCIe 6.0.  Completed ECNs include Combined Power and Relaxed Detect Timing.  Selected ECRs under development include TEE Device Interface Security Protocol (TDISP), DOE 1.1, CMA Update, ATS 2.0, and Unordered I/O (UIO).  Major protocol/spec changes for PCIe 6.0 include Flit Mode, Segment Support in Flit Mode, L0p replacing L0s in Flit Mode, Shared Flow Control Credits, 14-Bit Tags in Flit Mode, Max_Payload_Size enhancements, Deprecated features, and Improved SR-IOV spec integration.

PCIe 6.x PHY Logical
PCI Express (PCIe) specification has been doubling the data rate every generation in a backwards compatible manner every two to three years. PCIe 6.0 specification has adopted PAM-4 signaling at 64.0 GT/s for maintaining the same channel reach as prior generations. A forward error correction (FEC) mechanism will offset the high BER of PAM-4. A new Flit-based approach with a light-weight, low-latency FEC coupled with a strong CRC and a low-latency link level retry mechanism in PCIe 6.0 specification meets the stringent low-latency, high bandwidth and high reliability goals. Shared credit pooling across multiple virtual channels is included to reduce the area and power overhead while providing the necessary quality of service guarantees. We also present a new low-power state (L0p) that ensures power consumption is proportional to bandwidth usage without impacting the traffic flow.


Jean- Frederic Gauvin

Jean Frédéric began his tech journey as an engineer at Airbus Industries, advancing to consultancy in embedded software. Now at Dolphin Interconnect Solutions, he guides clients through complex tech landscapes. A passionate advocate for PCIe in embedded systems, he believes it’s key to achieving new levels of efficiency and performance.
Heterogeneous Multiprocessor System with PCIe Non-Transparent Bridging
This presentation will cover the sharing of high performance devices such as GPUs, FPGA and NVMes over a PCIe fabric. The interconnect between these devices can be provided by a single PCB, a short copper cable or via fiber optics over distances exceeding 100 meters. Industry has defined standards which range from the mobile edge, host CPUs, PXIe, CompactPCI Serial through server architectures defined by Open Compute. Here we will present resource utilization on the PCIe bus, and how to enhance scalability in data-intensive, low latency, high bandwidth applications.

Ming-Ren (Byrant) Hsu

Bryant Hsu is Product Manager for Vector Network Analyzers at Rohde & Schwarz. With 18 years of R&D and test & measurement experience, he specializes in signal integrity for high-speed interconnect testing. He holds an MS in electrical engineering and drives product analysis, strategic planning, and product development.
Characterization of 128GT/s Measurement Paths
With 128GT/s, PCIe 7.0 will double the data rate, and retaining PAM4 will also double physical bandwidth. To accurately test performance at this link speed, the measurement path from test equipment to pin must be characterized up to high frequencies for de-embedding. We'll discuss challenges in test board design, IEEE std 370 recommendations, and practical examples for accurate test fixture characterization and de-embedding. We'll also explore best practices for characterizing lead-in/lead-out at these frequencies and the importance of impedance-corrected de-embedding to ensure accurate measurements.

Sridevi Jagata

An application Engineer with over 4 years of experience in Verification, I specialize in verifying PCIe protocol specification requirements. My focus is on delivering advanced technical tailored solutions to industry needs. Passionate about bridging technology with real-word applications.
IDE Verification and Practical Implementation Insights
Security is no longer just a feature; it’s the foundation of modern systems. To address vulnerabilities in PCIe data transfer, we applied a comprehensive multi-layered verification of the Integrity and Data Encryption (IDE) framework. Through a suite of targeted verification techniques rigorously validating each IDE layer, we achieved an impressive 94% coverage in PCIe IDE verification, overcoming challenges in visibility and testbench integration. This paper provides in-depth insights into each technique and Challenges, discussing their unique contributions and offering practical solutions for testbench development. Our findings empower engineers to achieve comprehensive, spec-compliant verification and enhance the reliability of their designs.


Mohiuddin Mazumder
Mohiuddin Mazumder is a Senior Principal Engineer in Data Center and AI division of Intel. He leads the Electrical pathfinding and Standards development work for high-speed differential interconnect technologies. He co-chairs the PCI-SIG Electrical WG and also leads the PCIe 5.0/6.0 Internal and External Cables specification for 32 and 64 GT/.

PCIe 6.x Electrical Update
In this presentation, we will provide an overview of updates to the specification of Reference Clock, Transmitter, Receiver, and Channel Compliance for PCIe 6.0 64 GT/s data rate. We will highlight the key improvements in circuit and channels required for achieving doubling of the data rate over PCIe 5.0.


Manisha Nilange
Manisha Nilange is a Principal Engineer at Intel Corp. She has been with Intel Corp for 18 years. She leads multiple form-factor specification development, transmitter and receiver compliance test methodology and compliance tool development. Manisha chairs the PCI Express Card Electromechanical (CEM), PCI Express Mini (M.2) and PCI Express SFF Connector (U.2) workgroups in PCI-SIG and co-chairs the Serial Enabling workgroup. Manisha holds MS in Electrical Engineering from the University of Texas at Arlington.

PCIe CEM Updates 
This presentation provides updates on the PCI Express CEM specification development work in the PCI-SIG Electromechanical Workgroup. The presentation focuses on providing an overview of the changes introduced in PCI Express Card Electromechanical Specification, Rev 5.0 (CEM 5.0) and related ECRs. The presentation also provides an overview of several potential improvements under investigation for CEM 6.0. This includes Add-in Card outline updates, sideband interfaces and connector optimizations. 

PCIe Compliance Updates
The PCI-SIG has introduced the 5.0 Integrators List program with a new maximum data rate of 32 GT/s enabling a bi-direction link bandwidth up to 128 GB/s for a x16 link. The PCI Express Architecture PHY Test Specification Rev 5.0 has updated the 16 GT/s tests to support the faster rate and introduced new testing requirements including uncorrelated jitter and pulse width jitter for all 5.0 devices. Discussion of measurement methodologies for Tx Signal Quality and Link Equalization testing will provide insight into the latest measurement methodologies.

 
Richard Solomon
Richard Solomon is Technical Marketing Manager for Synopsys' PCIe Controller IP.  He’s been involved in PCI chip development since the original PCI spec, co-chairs the PCI-SIG compliance workgroup, and has served on the PCI-SIG Board of Directors for some 20 years. Richard holds a BSEE from Rice University and 27 US Patents, many PCI-related.

PCI Express Basics & Background 
In this session, attendees learn the basics of the PCI Express Architecture. This presentation covers the key features of PCI Express and provides an overview of the Electrical, Packet-based Protocol and Configuration Mechanism of this high-performance serial bus architecture. This session is geared towards attendees new to PCI Express Technologies. 
 
Jaydeep Suvariya

He has completed his master’s in engineering from Gujarat Technological University. He has been a Technical Lead in eInfochips an arrow company for the last 6+ years. (Worked on- AHB, USB3.0, Synopsys PCIe-5.95a, PCIe Gen3/4/5/6/7, and CXL3.0 protocol) Before joining this organization, he worked in ISRO Space Applications Centre. He has published a paper in the CDN Live event, SNUG, SIG, DevCon, and DvCon conferences.
Efficacious Verification of PCIe Speed Change Algorithm
This paper describes a case study on complex PCIe speed change mechanisms for Gen1 to Gen6. It also contains challenges and solutions while verifying the PCIe speed change algorithm compared to the legacy testbench. This paper also describes possible error injection to verify the PCIe speed change algorithm fully. With this approach we can find out many corner cases compared to legacy testbench and hence quality of IP is improved. With this approach I’m able to achieve all possible speed change scenario and achieve its coverage successfully. With this approach, the number of required tests to validate the whole speed change mechanism is reduced compared to legacy testbench.

Seiji Suzuki
Seiji Suzuki is a global alliance representative for the ExpEther technology. He has been working as an engineer for more than 30 years in NEC Corporation in fields of computers, communication, software and hardware. He also recently has been working with public cloud system and application vendors.

Large Scale Disaggregated Computing with ExpEther Technology

Optimizing PCIe resource allocation is a highly important issue for expanding AI infrastructure. ExpEther technology can help resolve this issue by realizing large scale disaggregated computing. ExpEther is an IP core which enables transferring PCIe bus data directly over Ethernet fabric. Devices implementing ExpEther combined with Ethernet cables and switches create a virtual PCIe switch over Ethernet networks, enabling extension of PCIe bus over 1km. ExpEther has succeeded in dynamically configurating systems which connect PCIe devices mounted in resource pools 1km away. ExpEther may also be applicable in other use cases like embedded industry solutions and automotive E/E architecture.